Chinese
Company Information
Company Name:
ChangChun Plastics. Co. Ltd.
Tel:
(02)2500-1800
Fax:
(02)2501-8018
Email:
Nationality:
CHINA
WebSite:
www.ccp-twn.com
Product List:
83
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Product List
O,O'-Dioctadecylpentaerythritol bis(phosphite)
3806-34-6
3-Bromopropyne
106-96-7
POLY[(O-CRESYL GLYCIDYL ETHER)-CO-FORMALDEHYDE]
29690-82-2
Azabenzene
110-86-1
FLEXIBLE COPPER CLAD LAMINATE
PBGA
Resin epoxy
24969-06-0
HEXAMINE
COPPER ELECTROLYTE
Polyvinyl Butyral Interlayer Film
DRY PAPER STRENGTH RESIN
MOLD CLEANER
Sodium formate
141-53-7
Trimethylol propane
77-99-6
Chromium
7440-47-3
FURFURYL ALCOHOL RESIN
25212-86-6
RECYCLED CLEANING LIQUID
INSULATION PAPER
PLASTICIZER
N,N'-Methylenebisacrylamide
110-26-9
POLY(VINYL ALCOHOL)
25213-24-5
Acetic acid glacial
64-19-7
polymer flocculant
LIQUID PHOTO RESIST
PHENOLIC COPPER CLAD LAMINATES
HIGH SOLIDS AMINO CROSSLINKING AGENT
THERMO PLASTIC POLYESTER ELASTOMER
PHOSPHITES ANTIOXIDANTS
NA
LACQUER THINNER
POLY(VINYL BUTYRAL)
27360-07-2
PAPER-PHENOLIC COPPER CLAD LAMINATE
GLASS FIBER (SHORT FIBER)
N/A
PROPYLENE GLYCOL METHYL ETHER ACETATE
84540-57-8
4,4'-DIHYDROXYDIPHENYLMETHANE
620-92-8
ETHYL 2-CYANOACRYLATE
7085-85-0
UREA RESIN MOLDING COMPOUND
UREA RESIN ADHESIVE
PvcStabilizer
EPOXY RESIN MOLDING COMPOUND
POLY BUTYLENE TEREPHTHALATE RESIN
s-Trioxane
110-88-3
OVER-LAY RESIN
SINGLE SIDE PPCCL
E-GLASS FIBER CHOPPED STRAND
DRY FILM PHOTO RESIST
HIGH PURITY HYDROGEN PEROXIDE FOR SEMI-CONDUCTOR
SYNTHETIC RESIN FOR COATING
WET PAPER STRENGTH RESIN
Epoxidized soya bean oil
8013-07-8
MELAMINE RESIN MOLDING COMPOUND
FORMAL SALINE
MOLD CLEANER FOR SEMI-CONDUCTOR
POLYETHYLENE DRUM
Methanol
67-56-1
3-Picoline
108-99-6
ETCHING LIQUID
Copper
7440-50-8
CHEMICAL MECHANICAL POLISHING
ELECTRONIC GRADE PROPYLENE GLYCOL MONOMETHYL ETHER
BROMINATED EPOXY FLAME RETARDANT
Carbomer 940
9003-01-4
RECYCLED FOIL
ELECTRONIC GRADE STRIPPER FOR SEMICONDUCTOR
PHENOLIC RESIN MOLDING COMPOUND
ELECTRONIC GRADE ETHANOL AMINE
ULTRA THIN MULTILAYER
ELECTRONIC GRADE THINNER FOR SEMICONDUCTOR
TEXTILE RESIN
POLYVINYL ACETATE EMULSION
HINDERED PHENOL ANTIOXIDANTS
POLY(VINYL ALCOHOL-CO-ETHYLENE)
26221-27-2
PHENOL-FORMALDEHYDE RESIN
9003-35-4
melamine resin adhesive
Butyl acetate
123-86-4
EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
TRIPHENYL PHOSPHATE FLAME RETARDANT
ELECTRONIC GRADE PROPYLENE GLYCOL MONOMETHYL ACETATE
ELECTRONIC GRADE NORMAL BUTYL ACETATE
Nicotinic acid
59-67-6
GLASS EPOXY COPPER CLAD LAMINATE
TETRAHYDROFURAN, FOR HPLC [SUBSTITUTED BY 34865 RIEDEL]
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