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企業の連絡先情報
名前:    ChangChun Plastics. Co. Ltd.
電話番号:    (02)2500-1800
ファックス番号:    (02)2501-8018
電子メール:   
国籍:    CHINA
ウェブサイト:    www.ccp-twn.com
商品の合計数:    83
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製品カタログ
O,O'-Dioctadecylpentaerythritol bis(phosphite) 3,9-ビス(オクタデシルオキシ)-2,4,8,10-テトラオキサ-3,9-ジホスファスピロ[5.5]ウンデカン 3806-34-6 C41H82O6P2
3-Bromopropyne プロパルギルブロミド 106-96-7 C3H3Br
POLY[(O-CRESYL GLYCIDYL ETHER)-CO-FORMALDEHYDE] オルソクレゾール ノボラック型 エポキシ樹脂 29690-82-2 C33H42O9X2
Azabenzene ピリジン [アミノ酸配列分析用] 110-86-1 C5H5N
FLEXIBLE COPPER CLAD LAMINATE
PBGA
Resin epoxy エピクロロヒドリン樹脂 24969-06-0 (C11H12O3)n
HEXAMINE
COPPER ELECTROLYTE
Polyvinyl Butyral Interlayer Film
DRY PAPER STRENGTH RESIN
MOLD CLEANER
Sodium formate ぎ酸ナトリウム 141-53-7 CHNaO2
Trimethylol propane トリメチロールプロパン 77-99-6 C6H14O3
Chromium クロム 7440-47-3 Cr
FURFURYL ALCOHOL RESIN フラン樹脂 25212-86-6 C21H26O3
RECYCLED CLEANING LIQUID
INSULATION PAPER
PLASTICIZER
N,N'-Methylenebisacrylamide N,N'-メチレンビスアクリルアミド 110-26-9 C7H10N2O2
POLY(VINYL ALCOHOL) ビニルアルコル·ビニルアセトアセテト共重 25213-24-5 (C2H4O)n
Acetic acid glacial 酢酸 [一般有機合成用] 64-19-7 C2H4O2
polymer flocculant
LIQUID PHOTO RESIST
PHENOLIC COPPER CLAD LAMINATES
HIGH SOLIDS AMINO CROSSLINKING AGENT
THERMO PLASTIC POLYESTER ELASTOMER
PHOSPHITES ANTIOXIDANTS
NA
LACQUER THINNER
POLY(VINYL BUTYRAL) 27360-07-2
PAPER-PHENOLIC COPPER CLAD LAMINATE
GLASS FIBER (SHORT FIBER)
N/A H2O2
PROPYLENE GLYCOL METHYL ETHER ACETATE 84540-57-8 C6H12O3
4,4'-DIHYDROXYDIPHENYLMETHANE 4,4'-ジヒドロキシジフェニルメタン 620-92-8 C13H12O2
ETHYL 2-CYANOACRYLATE α-シアノアクリル酸エチル 7085-85-0 C6H7NO2
UREA RESIN MOLDING COMPOUND
UREA RESIN ADHESIVE
PvcStabilizer
EPOXY RESIN MOLDING COMPOUND
POLY BUTYLENE TEREPHTHALATE RESIN
s-Trioxane 1,3,5-トリオキサン 110-88-3 C3H6O3
OVER-LAY RESIN
SINGLE SIDE PPCCL
E-GLASS FIBER CHOPPED STRAND
DRY FILM PHOTO RESIST
HIGH PURITY HYDROGEN PEROXIDE FOR SEMI-CONDUCTOR
SYNTHETIC RESIN FOR COATING
WET PAPER STRENGTH RESIN
Epoxidized soya bean oil エポキシ化脂肪酸グリセライド(ただし脂肪酸はC 1424) 8013-07-8
MELAMINE RESIN MOLDING COMPOUND
FORMAL SALINE CH2O
MOLD CLEANER FOR SEMI-CONDUCTOR
POLYETHYLENE DRUM [C2H4]n
Methanol メタノール 67-56-1 CH4O
3-Picoline 3-ピコリン 108-99-6 C6H7N
ETCHING LIQUID
Copper 7440-50-8 Cu
CHEMICAL MECHANICAL POLISHING
ELECTRONIC GRADE PROPYLENE GLYCOL MONOMETHYL ETHER
BROMINATED EPOXY FLAME RETARDANT
Carbomer 940 ポリアクリル酸 9003-01-4 C3H4O2
RECYCLED FOIL
ELECTRONIC GRADE STRIPPER FOR SEMICONDUCTOR
PHENOLIC RESIN MOLDING COMPOUND
ELECTRONIC GRADE ETHANOL AMINE
ULTRA THIN MULTILAYER
ELECTRONIC GRADE THINNER FOR SEMICONDUCTOR
TEXTILE RESIN
POLYVINYL ACETATE EMULSION
HINDERED PHENOL ANTIOXIDANTS
POLY(VINYL ALCOHOL-CO-ETHYLENE) エチレン·酢酸ビニル共重の加水分解物 26221-27-2
PHENOL-FORMALDEHYDE RESIN ホルムアルデヒド·フェノル重 9003-35-4 C7H6O2
melamine resin adhesive
Butyl acetate 酢酸ブチル 123-86-4 C6H12O2
EPOXY MOLDING COMPOUND FOR SEMICONDUCTOR ENCAPSULATION
TRIPHENYL PHOSPHATE FLAME RETARDANT
ELECTRONIC GRADE PROPYLENE GLYCOL MONOMETHYL ACETATE
ELECTRONIC GRADE NORMAL BUTYL ACETATE
Nicotinic acid ニコチン酸 59-67-6 C6H5NO2
GLASS EPOXY COPPER CLAD LAMINATE
TETRAHYDROFURAN, FOR HPLC [SUBSTITUTED BY 34865 RIEDEL] C4H8O
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